| > SOLDER IRON |
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Electric or electronic heating device used for Solder melting in order to put together metal pieces, as electronic Device on PC Board. |
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| > SOLDER |
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metal Alloy (lead, tin, silver…) with melting temperature (liquidus) from 160 to 250 °C and more. Standard is Sn63Pb37 at 183°C real eutectic. |
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| > SOLDERING STATION |
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Electronic Apparatus included Iron (low voltage) and system of Temperature regulating . |
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| > DESOLDERING STATION |
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Electronic Apparatus included desoldering vacuum Iron with thermal regulation in order to remove an electronical Component by Solder Suction. |
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| > SMD or SMC |
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Surface mounting Device or Component. |
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| > REPAIR OR REWORK STATION |
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Set of soldering and desoldering Station with or without hot Air Generator. |
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| > TIP |
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Interchangeable End of the Iron ; generally made of Copper with a special treatment in order to limit effect of Temperature and Lead. |
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| > NOZZLE |
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Interchangeable End of desoldering Iron. |
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| > ESD Safe |
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Apparatus or Component protected against Electrostatic high Voltage |
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| > BGA |
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Ball Grid Array |
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| > LEAD FREE SOLDER |
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New Solder without Lead; to replace with Silver and/or Copper; melting Temperature is about 30°C more than standard Solder. Standard : Sn96.5Ag3.0Cu0.5 at 217°C or Sn96.3Ag3.7 at 221°C real eutectic. |
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